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Semiconductor Wafer Cleaning (Wet Bench) Processes
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Heating of Photo-Resist Removal Solvents
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DI water Heating for Wafer Rinsing
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Air and Nitrogen Heating for Wafer Drying
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Heating of Acids, IPA, Piranha, NMP, etc.
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For Use with Single Pass or Recirculating Systems
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Fluid Path has No Contact with Heating Elements
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Media is Isolated in PFA (Teflon®) Flow-Tube (High Purity Heating)
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Allows for Safe Heating of Dangerous Liquids & Gases
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Flow-Tube is Safe for Use with Many Caustic Solvents
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Flow-Tube Is Field Replaceable (No Service Call Required)
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Compatible with Standard Controls (PID, PLC, Multi-Loop, etc.)
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Body is Teflon® Coated, for Maximum Cleanliness
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Self-Draining Flow-Tubes, and Long-Life Heating Elements
Specifications:
Power:
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5 kW Total to 7.9 kW Total
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Voltage Range: 200 - 480 V
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Max Line Current: 30 A per circuit
Tubing:
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.375” OD (3/8”) (9.52 mm)
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.031” Wall (.80 mm)
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Overall Process Tube Length: 325" (8255 mm)
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PFA (PerFluoroAlkoxy) / Teflon® (standard)
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High Purity PFA (optional upgrade)
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Max Pressure: 70 psi (4.82 bar)
Body:
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Aluminum with Black Teflon® Protective Coating
Enclosures:
Max Working Temperature:
Sensors:
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K or J Type Thermocouples Standard (Qty. 3)
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1 for Process Control
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1 for High-Limit Protection
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1 for Tube Temperature Protection
Available Accessories:
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Insulating Jackets
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Compression Fittings